Copper Powder Products

Copper powder products are classified by purity, production method, grain and density. Variations in the shape of copper particles, density and the surface condition of particles greatly affect the usability of copper powder for certain applications. Following are some of the most widely used copper powder products.

CU165

Copper Powder 99.3%, General Purpose, 150 Mesh

The most popular and widely used copper powder, produced by water atomization method followed by hydrogen reduction.

Additional Description

CU155A

Copper Powder 99.5% - 99.9%

Very high purity, air atomized, hydrogen reduced ultra fine copper powder. Spherical particle. High conductivity. High Density.

Additional Description

Product Specifications

Purity	99.81%
Iron	0.01%
Hydrogen Loss	0.18%
Apparent Density	4.89 g/cc
Sieve Analysis	+200 Mesh: 0% -200/+325 Mesh: 4.8% -325 Mesh: 95.2%
HTS Code	7406.10.0000
NMFC	30743
CAS No.	7440-50-8
Product Code	CU112SP

Recommended for: Thick and Thin Film pastes Capacitor Chips End cap Terminators Conductive Inks, paints and pastes Injection Molding Electronics Thermal management EDM Electrodes Thermal Sprays Sintered alloys/ products Brazing/ soldering paste

Typical Analysis:
Copper: 99.81%
Iron: 0.01%
Hydrogen Loss: 0.18%
Apparent Density: 4.89 g/cc
SIEVE ANALYSIS
+200 MESH: 0%
-200+325 MESH: 4.8%
-325 MESH: 95.2%

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CU301-E

Copper Powder 99.8%, Electronic Grade, Mesh 325

Electronic grade Copper powder, high purity, water atomized, hydrogen reduced ultra fine copper powder with spheroidal particles. Higher conductivity. Lower Density.

Additional Description

Product Specifications

Purity	99.85%
Hydrogen Loss	0.19%
Apparent Density	2.97 g/cc
Mesh Size	325 mesh
Sieve Analysis	+60 Mesh: 0% -60/+80 Mesh: 0% -80/+100 Mesh: 0% -100/+140 Mesh: Trace -140/+200 Mesh: Trace -200/+325 Mesh: 0.6% -325 Mesh: 99.4%
HTS Code	7406.10.0000
NMFC	30743
CAS No.	7440-50-8

Recommended for: Thick and Thin Film pastes Capacitor Chips End cap Terminators Conductive Inks, paints and pastes Injection Molding Electronics Thermal management EDM Electrodes Thermal Sprays Sintered alloys/ products Brazing/ soldering paste

Typical Analysis:
Copper: 99.85%
Hydrogen Loss: 0.19%
Apparent Density: 2.97 g/cc
SIEVE ANALYSIS
+60 MESH: 0%
-60/+80 MESH: 0%
-80/+100 MESH: 0%
-100/+140 MESH: TR
-140/+200 MESH: TR
-200/+325 MESH: 0.6%
-325 MESH: 99.4%

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CUPDR

COPPER POWDER 99.9% (150 Mesh)

Highly pure 99.9% copper powder made from electrolytic copper. Mesh 150 Granular Copper.

Additional Description

variety of uses in the electrical and electronic industries because of its excellent electrical and thermal conductivities. Also used in self-lubricating bearing ,brazing, cold soldering, and mechanical plating, as well as for antifouling paints, decorative and protective coatings and printing inks. medals and medallions, metal-plastic decorative products and a variety of chemical and medical purposes.

Product Specifications

Purity	>99%
Mesh Size	150 - 325
Screen Analysis	+60: 0.0% -60/+100: 0.7% -100/+200: 89.7% -200/+325: 9.1% -325: 0.5%

Applications and Benefits: Electrical and electronic applications Self-lubricating bearings Brazing and cold soldering Mechanical plating Antifouling paints and decorative coatings Printing inks Medals, medallions, and metal-plastic decorative products Chemical and medical purposes

 

Analysis in percent	.......	Screen Analysis
60		0.0
60-100		0.7
100-200		89.7
200-325		9.1
325		0.5

Apparent Density: 3 g/cc

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CU12HP

Copper Granules, 16 Mesh

Coarse copper powder for wood inlay and industrial applications.

Additional Description

CU23HP

Copper Granules, Mesh 20 (Coarse Copper Powder)

High-purity coarse copper powder with spherical metal crystals.

Additional Description

CU35HP

Copper Granules, 35 Mesh (Coarse Copper Powder)

High-purity coarse copper granules, spherical, 35 mesh size.

Additional Description

CU7005F

Copper Powder, Flaked, Waxed, Pigment

Artistic, metallic-shine copper powder for inks and paints.

Additional Description

Copper Powder offers exceptional metallic shine, ideal for metallic inks and paints. Compatible with most resins and conductive for ink creation.
 

Product Specifications

Type	Copper Powder
Use	Metallic Inks, Paints
Compatibility	Polyurethane, Polyacrylic, Polyester
Conductivity	Suitable for Conductive Inks
Pigment Quality	Art Grade

Similar Products Metallic-shine gold powder for inks Silver pigment powder, art-grade Bronze powder, resin-compatible Reflective aluminum powder, versatile Artistic brass powder for painting

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CU112SP

Copper Powder, Super Fine, Spherical

High-density copper powder for superior conductivity and casting.

Additional Description

CU112SP is a super fine, high density, high purity spherical copper powder that provides high heat conductivity and electrical conductivity properties to your products. Our specification guarantees that at least 95% of this powder are particles smaller than 44 micron. A typical analysis however shows that 99.9% of particles are smaller than 44 micron. Most particles are between 10 micron and 22 micron.

HTS Code: 7406.10.0000
NMFC: 30743
CAS: 7440-50-8

Applications include cold casting, 3-D printer filaments, metal clay, sintering, Green/ blue patina and rust effect, preventing mold in concrete, plaster,dry-wall, paint, adhesives and grout. Also used in 3D printing process known as Selective Powder Deposition (SPD) Old product code: CU155A

Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.
 

Product Specifications

Particle Size	95% < 44 microns
Purity	> 99.2% Copper
Apparent Density	4.5 - 5.5 g/cc
Hydrogen Loss	< 0.7%
Mesh Passing	99.9% through 325 (44 micron)

Similar Products Fine silver powder, high conductivity Spherical bronze powder, 3D printing Fine aluminum powder, thermal conductivity High-purity zinc powder, corrosion resistance Spherical titanium powder, lightweight strength

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CU118SP

Copper Powder, Fine, Spherical

High-purity, high-density spherical copper powder for enhanced conductivity and versatility.

Additional Description

CU118SP is a fine, high density, high purity spherical copper powder that provides high heat conductivity and electrical conductivity properties to your products. Our specification guarantees that at least 80% of this powder are particles smaller than 44 micron. A typical analysis however shows that 88% of particles are smaller than 44 micron. Most particles are between 16 micron and 28 micron.
Applications include cold casting, 3-D printer filaments, metal clay, sintering, Green/ blue patina and rust effect, preventing mold in concrete, plaster,dry-wall, paint, adhesives and grout.
Also used in 3D printing process known as Selective Powder Deposition (SPD)
Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.
 

Product Specifications:

Copper Purity	Over 99.5%
Hydrogen Loss	Less than 0.7%
Apparent Density	4.5-5.5 g/cc
Typical Analysis	Copper > 99.5% Hydrogen Loss < 0.7% Apparent Density, g/cc: 4.5 - 5.5 Passing mesh 325 (44 micron): 80% ~ 88%

Similar Products: Ultra-Fine Copper Powder High-Purity Copper Foil Copper Wire Copper Rod Copper Sheet

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CU301

Copper Powder 99.3%, Mesh 325

Ultra-fine, high-purity copper powder with spheroidal particles.

Additional Description

Ultra-fine, high-purity copper powder made via water atomization and hydrogen reduction. Features spheroidal particles and clusters, offering higher conductivity and lower density. Suitable for metal injection molding and applications requiring high conductivity and purity. Typical applications include conductive inks, paints, pastes, thermal sprays, and sintered products. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.  

Product Specifications

Purity	99.31%
Hydrogen Loss	0.39%
Apparent Density	2.97 g/cc
Mesh Size	325 mesh
Sieve Analysis	+60 Mesh: 0% -60/+80 Mesh: 0% -80/+100 Mesh: 0% -100/+140 Mesh: Trace -140/+200 Mesh: Trace -200/+325 Mesh: 0.6% -325 Mesh: 99.4%
HTS Code	7406.10.0000
NMFC	30743
CAS No.	7440-50-8

Applications and Benefits: Thick and thin film pastes Conductive inks, paints, and pastes Injection molding Thermal management EDM electrodes Antifouling paints Thermal sprays Sintered alloys/products Brazing/soldering paste

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CU264

Copper Powder, 99.5%, Mesh 100

High purity copper powder for powder metallurgy.

Additional Description

High purity copper powder, nominal mesh 100, Apparent density: 2.6 g/cc, Copper > 99.5%, with irregular shape particles. Used in powder metallurgy. May be admixed with other metal powders and graphite for specific properties such as strength, hardness and wear resistance for structural parts.

HTS Code: 7406.10.0000
NMFC: 30743
CAS: 7440-50-8

Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.  

Product Specifications

Apparent Density	2.6 g/cc
Purity	> 99.5% Copper
Particle Shape	Irregular
Conductivity	At higher voltages/when compacted
Applications	Powder Metallurgy, Alloys

Similar Products High purity bronze powder, metallurgy Fine granular aluminum powder, industrial Nickel powder, high density, 99% purity Spherical zinc powder, corrosion-resistant Iron powder, magnetic, for alloys

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CU279

Copper Powder 99+%, Mesh 200

High-purity, fine copper powder with irregular particles, mesh 200.

Additional Description

High-purity copper powder made via water atomization and hydrogen reduction. Features very fine, irregular particles and clusters with relatively lower density. Recommended for applications requiring high purity and conductivity, including diamond wheels, sintering, and chemical reactions. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will conduct when compacted or mixed with oils or resins.  

Product Specifications

Purity	99.3%
Hydrogen Loss	0.39%
Apparent Density	2.6 - 2.8 g/cc
Mesh Size	200 mesh
Sieve Analysis	+100 Mesh: Trace +140 Mesh: 1% Max +200 Mesh: 3% Max +325 Mesh: Balance -325 Mesh: 90% Min
HTS Code	7406.10.0000
NMFC	30743
CAS No.	7440-50-8

Applications and Benefits: Thick and thin film pastes Conductive inks, paints, and pastes Injection molding Thermal management EDM electrodes Antifouling paints Thermal sprays Sintered alloys/products Brazing/soldering paste Diamond wheels Chemical reactions

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CU41

CU41, Copper Powder, Mesh 40 (Coarse)

High purity, dark-colored, coarse copper powder.

Additional Description

High purity atomized copper powder -40/ 100 US Mesh has the largest grains compared with our other copper powder products. It is also usually darker in color. Minimum purity: 99.0%. Typical Apparent Density: 2.4. Nominal Mesh: -40/ 100. HTS Code: 7406.10.0000. NMFC: 30743. CAS: 7440-50-8. Typical Analysis: Copper: 99.87%, Hydrogen Loss: 0.21%, Apparent Density: 2.57 g/cc. Sieve Analysis: 40 mesh 0%, -40/ 100 mesh 90.4%, -100/ 140 mesh 9%, -140 mesh 0.6%.  

Product Specifications

Purity	99.87%
Hydrogen Loss	0.21%
Apparent Density	2.57 g/cc
Mesh Size	>40 mesh 0% -40/ 100 mesh 90.4% -100/ 140 mesh 9% -140 mesh 0.6%
HTS Code	7406.10.0000
NMFC	30743
CAS Number	7440-50-8

Similar Products Fine grain, 99% pure copper powder Medium grain, dark copper powder High-density, fine copper powder Coarse, 98% pure copper flakes Atomized, spherical copper granules

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Please contact 973-405-6247 to discuss your specific requirements based on your applications.