Copper Powder Products
 

Copper Powder Uses

 
  Copper Powder for Sintering
 
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  Copper Powders LLC Research Center
1059 Main Ave,
Clifton, NJ 07011

Tel: 973-405-6247

 

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Copper Powder Products

Copper powder products are classified by purity, production method, grain and density. Variations in the shape of copper particles, density and the surface condition of particles greatly affect the usability of copper powder for certain applications.

Following are some of the most widely used copper powder products.

CU165

Copper Powder 99.3%, General Purpose, 150 Mesh

The most popular and widely used copper powder, produced by water atomization method followed by hydrogen reduction.

Additional Description

Product Details:
Purity: 99.3%
Apparent Density: 2.7 g/cc
Nominal Mesh: -140
-325 mesh ratio > 50%
Application: General purpose, brazing, chemical, electronics, paints, ...

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CU155A

Copper Powder 99.5% - 99.9%

Very high purity, air atomized, hydrogen reduced ultra fine copper powder. Spherical particle. High conductivity. High Density.

Additional Description

Recommended for:
  • Thick and Thin Film pastes
  • Capacitor Chips
  • End cap Terminators
  • Conductive Inks, paints and pastes
  • Injection Molding
  • Electronics
  • Thermal management
  • EDM Electrodes
  • Thermal Sprays
  • Sintered alloys/ products
  • Brazing/ soldering paste

Typical Analysis:
Copper: 99.81%
Iron: 0.01%
Hydrogen Loss: 0.18%
Apparent Density: 4.89 g/cc
SIEVE ANALYSIS
+200 MESH: 0%
-200+325 MESH: 4.8%
-325 MESH: 95.2%

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CU301-E

Copper Powder 99.8%, Electronic Grade, Mesh 325

Electronic grade Copper powder, high purity, water atomized, hydrogen reduced ultra fine copper powder with spheroidal particles. Higher conductivity. Lower Density.

Additional Description

Recommended for:
  • Thick and Thin Film pastes
  • Capacitor Chips
  • End cap Terminators
  • Conductive Inks, paints and pastes
  • Injection Molding
  • Electronics
  • Thermal management
  • EDM Electrodes
  • Thermal Sprays
  • Sintered alloys/ products
  • Brazing/ soldering paste

Typical Analysis:
Copper: 99.85%
Hydrogen Loss: 0.19%
Apparent Density: 2.97 g/cc
SIEVE ANALYSIS
+60 MESH: 0%
-60/+80 MESH: 0%
-80/+100 MESH: 0%
-100/+140 MESH: TR
-140/+200 MESH: TR
-200/+325 MESH: 0.6%
-325 MESH: 99.4%

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CUPDR

COPPER POWDER 99.9% (150 Mesh)

Highly pure 99.9% copper powder made from electrolytic copper. Mesh 150 Granular Copper.

Additional Description

variety of uses in the electrical and electronic industries because of its excellent electrical and thermal conductivities. Also used in self-lubricating bearing ,brazing, cold soldering, and mechanical plating, as well as for antifouling paints, decorative and protective coatings and printing inks. medals and medallions, metal-plastic decorative products and a variety of chemical and medical purposes.
 
Analysis in percent ....... Screen Analysis
60   0.0
60-100   0.7
100-200   89.7
200-325   9.1
325   0.5

Apparent Density: 3 g/cc

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Please contact 973-405-6247 to discuss your specific requirements based on your applications.

 

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